Kategorie: Pressemitteilungen

AMD to Host Accelerated Data Center Premiere Virtual Event on November 8, 2021

SANTA CLARA, Calif. 10/25/2021 -AMD (NASDAQ: AMD) will host its Acce­le­ra­ted Data Cen­ter Pre­mie­re on Novem­ber 8, 2021 at 11 a.m. ET, show­ca­sing the company’s upco­ming inno­va­tions with AMD EPYC™ pro­ces­sors and AMD Instinct™ acce­le­ra­tors.

The vir­tu­al event is sla­ted to fea­ture pre­sen­ta­ti­ons from AMD Pre­si­dent and CEO Dr. Lisa Su, Seni­or Vice Pre­si­dent and Gene­ral Mana­ger, Data Cen­ter and Embedded Solu­ti­ons Busi­ness Group For­rest Nor­rod, and Seni­or Vice Pre­si­dent and Gene­ral Mana­ger, Ser­ver Busi­ness Unit Dan McNamara.

The event will be acces­si­ble to the public at www.amd.com/en/events/data-center start­ing at 11 a.m. ET. A replay will be available and can be acces­sed after the con­clu­si­on of the live­stream event.

Supporting Resources:

(…) Wei­ter­le­sen »

Intel Reports Third-Quarter 2021 Financial Results

News Sum­ma­ry

▪       Third-quar­ter GAAP reve­nue of $19.2 bil­li­on, up 5% year over year (YoY), and non-GAAP reve­nue of $18.1 bil­li­on, up 5% YoY.  Achie­ved all-time record reve­nue in Intel’s Inter­net of Things Group (IOTG) and record third-quar­ter reve­nue in the Data Cen­ter Group (DCG) and Mobi­leye businesses. 

▪       Third-quar­ter GAAP ear­nings-per-share (EPS) was $1.67; non-GAAP EPS was $1.71, which excee­ded July gui­dance by $0.61. Excee­ded July gui­dance for EPS and gross margin.

▪      Rai­sing full-year 2021 EPS and gross mar­gin gui­dance. Now expec­ting GAAP EPS of $4.50 and non-GAAP EPS of $5.28 and GAAP gross mar­gin of 55% and non-GAAP gross mar­gin of 57%1.

▪       Intel CFO Geor­ge Davis announ­ced plans to reti­re in May 2022.

 

SANTA CLARA, Calif., Octo­ber 21, 2021 — Intel Cor­po­ra­ti­on today repor­ted third-quar­ter 2021 finan­cial results.

Q3 sho­ne an even grea­ter spot­light on the glo­bal demand for semi­con­duc­tors, whe­re Intel has the uni­que breadth and sca­le to lead. Our focus on exe­cu­ti­on con­tin­ued as we star­ted deli­ve­ring on our IDM 2.0 com­mit­ments. We bro­ke ground on new fabs, shared our acce­le­ra­ted path to regain pro­cess per­for­mance lea­der­ship, and unvei­led our most dra­ma­tic archi­tec­tu­ral inno­va­tions in a deca­de. We also announ­ced major cus­to­mer wins across every part of our busi­ness,” said Pat Gel­sin­ger, Intel CEO. “We are still in the ear­ly stages of our jour­ney, but I see the enorm­ous oppor­tu­ni­ty ahead, and I couldn’t be prou­der of the pro­gress we are making towards that opportunity.”

Q3 2021 Finan­cial Highlights

  GAAP   Non-GAAP
  Q3 2021 Q3 2020 vs. Q3 2020   Q3 2021 Q3 2020 vs. Q3 2020
Reve­nue ($B) $19.2 $18.3 up 5%   $18.1 $17.3 up 5%
Gross Mar­gin 56.0% 53.1% up 2.9 ppt   57.8% 56.5% up 1.3 ppt
R&D and MG&A ($B) $5.5 $4.7 up 16%   $5.3 $4.5 up 17%
Ope­ra­ting Margin 27.2% 27.6% down 0.4 ppt   28.8% 30.4% down 1.7 ppt
Tax Rate 0.5% 15.2% down 14.7 ppt   0.4% 15.4% down 15 ppt
Net Inco­me ($B) $6.8 $4.3 up 60%   $7.0 $4.5 up 54%
Ear­nings Per Share $1.67 $1.02 up 64%   $1.71 $1.08 up 59%

In the third quar­ter, the com­pa­ny gene­ra­ted $9.9 bil­li­on in cash from ope­ra­ti­ons and paid divi­dends of $1.4 billion.

(…) Wei­ter­le­sen »

AMD Ryzen™ Threadripper™ PRO Processors Selected for Next-Generation NVIDIA GeForce NOW Cloud Gaming Platform

ANTA CLARA, Calif., Oct. 21, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced Ryzen™ Thre­ad­rip­per™ PRO pro­ces­sors will help power the new GeForce NOW RTX 3080 mem­ber­ship tier from NVIDIA. Dri­ven by AMD Ryzen Thre­ad­rip­per PRO pro­ces­sors, the new GeForce NOW RTX 3080 mem­ber­ship gives next-gene­ra­ti­on cloud gam­ing expe­ri­en­ces to play­ers everywhere.

NVIDIA’s GeForce Super­Pods harness the class-lea­ding per­for­mance of AMD Ryzen Thre­ad­rip­per PRO with unpar­al­le­led core counts and high-fre­quen­cy clock speeds to sup­port over 39 peta­flops of gra­phics per­for­mance. Each pro­ces­sor also fea­tures 128 PCIe® Gen 4 lanes, indus­try-lea­ding con­nec­ti­vi­ty, and unmat­ched memo­ry band­width1 to ensu­re GeForce NOW RTX 3080 mem­bers have the tech­no­lo­gy requi­red for a smooth, relia­ble experience.

The Ryzen Thre­ad­rip­per PRO lin­e­up was desi­gned to offer users incre­di­ble per­for­mance and unri­va­led band­width and sets the indus­try stan­dard for extre­me com­pu­ting per­for­mance across a ran­ge of use cases, inclu­ding the rapidly-gro­wing cloud gam­ing space,” said Chris Kilb­urn, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, cli­ent com­po­nent busi­ness, AMD. “Working with NVIDIA, it is clear that the expan­si­ve fea­ture set of Ryzen Thre­ad­rip­per PRO is the per­fect plat­form to power their next-gene­ra­ti­on cloud gam­ing expe­ri­ence.” (…) Wei­ter­le­sen »

Blacknut Cloud Gaming Solution Powered by Radian Arc’s Latest GPU Edge Computing Platform and AMD Radeon™ PRO V520 Graphics plus AMD EPYC™ Series Processors

LOS ANGELES – Octo­ber 20, 2021 – Black­nut will be pre­sen­ting its cloud gam­ing solu­ti­on, built on Radi­an Arc’s turn­key Infra­struc­tu­re as a Ser­vice (IaaS) GPU-Edge plat­form which is powered by AMD Rade­on™ PRO V520 GPUs and AMD EPYC™ CPUs, at Mobi­le World Con­gress Los Ange­les 2021 in the AMD booth #1820.

Cloud gam­ing is an emer­ging cate­go­ry in the games indus­try with mar­ket pro­jec­tions esti­ma­ted to exceed $6 bil­li­on in reve­nue by 2024. Black­nut is the lea­ding cloud gam­ing solu­ti­on dis­tri­bu­ted to con­su­mers and busi­nesses through ISPs, device manu­fac­tu­r­ers, over the top ser­vices and media companies.

Radi­an Arc and Black­nut have deve­lo­ped a turn­key solu­ti­on for cloud gam­ing uti­li­zing AMD Rade­on PRO V520 GPUs and AMD EPYC CPUs to harness a high-per­for­mance gam­ing archi­tec­tu­re, deli­ver­ed across ISPs inclu­ding 5G net­works. (…) Wei­ter­le­sen »

AIDA64 v6.50 Press Release

GeForce RTX LHR Monitoring and Windows 11 Support

BUDAPEST, Hun­ga­ry — Oct 19, 2021 — Final­Wire Ltd. today announ­ced the imme­dia­te avai­la­bi­li­ty of AIDA64 Extre­me 6.50 soft­ware, a stream­li­ned dia­gno­stic and bench­mar­king tool for home users; the imme­dia­te avai­la­bi­li­ty of AIDA64 Engi­neer 6.50 soft­ware, a pro­fes­sio­nal dia­gno­stic and bench­mar­king solu­ti­on for cor­po­ra­te IT tech­ni­ci­ans and engi­neers; the imme­dia­te avai­la­bi­li­ty of AIDA64 Busi­ness 6.50 soft­ware, an essen­ti­al net­work manage­ment solu­ti­on for small and medi­um sca­le enter­pri­ses; and the imme­dia­te avai­la­bi­li­ty of AIDA64 Net­work Audit 6.50 soft­ware, a dedi­ca­ted net­work audit tool­set to coll­ect and mana­ge cor­po­ra­te net­work inventories.

The new AIDA64 update intro­du­ces sup­port for Win­dows 11 and AMD 4700S pro­ces­sor, moni­to­ring of sen­sor values on VoCo­re LCD dis­plays, and sup­ports the latest AMD and Intel CPU plat­forms as well as the new gra­phics and GPGPU com­pu­ting tech­no­lo­gies by both AMD and nVIDIA.

New features & improvements

  • Micro­soft Win­dows 11 and Win­dows Ser­ver 2022 support
  • AVX2 and FMA acce­le­ra­ted 64-bit bench­marks for AMD 4700S Car­di­nal CPU
  • Impro­ved sup­port for Intel Alder Lake CPU
  • Aqua Com­pu­ter Leak­S­hield sen­sor support
  • Impro­ved sup­port for pro­ces­sors with 64 or more cores
  • Matrix Orbi­tal EVE4 and VoCo­re LCD support
  • Enhan­ced sup­port for LGA-1700 motherboards
  • Sup­port for VMware Work­sta­tion v16
  • Rama­xel AM620 and AV310 SSD support
  • GPU details for AMD Rade­on RX 6600M and 6700M Series
  • GPU details for nVI­DIA CMP 50HX, CMP 170HX, GeForce RTX 3000 LHR Series

(…) Wei­ter­le­sen »

Oski Technology, an Expert in Formal Verification, Joins NVIDIA

We are exci­ted to announ­ce that Oski Tech­no­lo­gy, a com­pa­ny spe­cia­li­zing in for­mal veri­fi­ca­ti­on methods, will be joi­ning NVIDIA.

Modern pro­ces­sors pack tens of bil­li­ons of tran­sis­tors, tiny on/off swit­ches con­nec­ted by bil­li­ons of micro­sco­pic pathways. A bug in a sin­gle tran­sis­tor can pre­vent a chip from ope­ra­ting cor­rect­ly, requi­ring cos­t­ly revi­si­ons to fix.

Today, veri­fi­ca­ti­on engi­neers rely on two very dif­fe­rent methods to make sure bugs don’t make it into sili­con — simu­la­ti­on and for­mal verification.

The first approach reli­es on mil­li­ons of simu­la­ti­ons that search for bugs, exer­cis­ing cor­ner cases in careful­ly desi­gned tests.

For­mal veri­fi­ca­ti­on, Oski’s spe­cial­ty, is a powerful alter­na­ti­ve that uses mathe­ma­ti­cal ana­ly­sis of a design ins­tead of simu­la­ti­ons to pro­ve that a par­ti­cu­lar fea­ture beha­ves cor­rect­ly for all pos­si­ble inputs.

Whe­re­as simu­la­ti­on injects 1’s and 0’s into a design to test whe­ther num­bers are added pro­per­ly, Oski’s approach for­mal­ly veri­fies that “c = a + b.” (…) Wei­ter­le­sen »

TSMC Reports Third Quarter EPS of NT$6.03

Hsin­chu, Tai­wan, R.O.C., Oct. 14, 2021TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$414.67 bil­li­on, net inco­me of NT$156.26 bil­li­on, and diluted ear­nings per share of NT$6.03 (US$1.08 per ADR unit) for the third quar­ter ended Sep­tem­ber 30, 2021.

Year-over-year, third quar­ter reve­nue increased 16.3% while net inco­me and diluted EPS both increased 13.8%. Com­pared to second quar­ter 2021, third quar­ter results repre­sen­ted a 11.4% increase in reve­nue and a 16.3% increase in net inco­me. All figu­res were pre­pared in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, third quar­ter reve­nue was $14.88 bil­li­on, which increased 22.6% year-over-year and increased 12.0% from the pre­vious quarter.

Gross mar­gin for the quar­ter was 51.3%, ope­ra­ting mar­gin was 41.2%, and net pro­fit mar­gin was 37.7%. (…) Wei­ter­le­sen »

AMD to Report Fiscal Third Quarter 2021 Financial Results

SANTA CLARA, Calif., Oct. 13, 2021 — AMD (NASDAQ: AMD) announ­ced today that it will report third quar­ter 2021 finan­cial results on Tues­day, Octo­ber 26, 2021 after the clo­se of mar­ket. Manage­ment will con­duct a con­fe­rence call to dis­cuss the­se results at 5:00 p.m. EDT / 2:00 p.m. PDT. Inte­res­ted par­ties are invi­ted to lis­ten to the web­cast of the con­fe­rence call via AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.

(…) Wei­ter­le­sen »

AMD Radeon™ RX 6600 Graphics Card Delivers Incredible High-Refresh Rate 1080p Gaming

– Up to 1.3X bet­ter per­for­mance-per-watt than the com­pe­ti­ti­on in sel­ect titles at 1080p max settings –

– Harnes­ses AMD RDNA 2 gam­ing archi­tec­tu­re, AMD Fide­li­ty­FX Super Reso­lu­ti­on, AMD Infi­ni­ty Cache, AMD Smart Access Memo­ry tech­no­lo­gy and other powerful fea­tures to pro­vi­de enthu­si­ast-level per­for­mance and stun­ning visu­al fidelity –

SANTA CLARA, Calif. 

AMD (NASDAQ: AMD) today laun­ched the AMD Rade­on™ RX 6600 gra­phics card, desi­gned to pro­vi­de visual­ly stun­ning, high-refresh rate 1080p gam­ing expe­ri­en­ces to the midran­ge market.

The AMD Rade­on RX 6600 gra­phics card lever­a­ges breakth­rough AMD RDNA™ 2 archi­tec­tu­re, the only gam­ing archi­tec­tu­re that spans from desk­top PCs, lap­tops and con­so­les to mobi­le devices and auto­mo­ti­ve info­tain­ment sys­tems. Offe­ring 32 MB of high-per­for­mance AMD Infi­ni­ty Cache, 8GB of GDDR6 memo­ry, AMD Smart Access Memo­ry™ tech­no­lo­gy and sup­port for the Micro­soft Win­dows 11 ope­ra­ting sys­tem, the AMD Rade­on RX 6600 gra­phics card is desi­gned to bring next-gene­ra­ti­on desk­top-level expe­ri­en­ces to PC gamers. It also sup­ports the AMD Fide­li­ty­FX™ Super Reso­lu­ti­on open-source spa­ti­al ups­ca­ling solu­ti­on, which is desi­gned to increase frame­ra­tes in sel­ect titles while deli­ve­ring high-reso­lu­ti­on gam­ing expe­ri­en­ces. (…) Wei­ter­le­sen »

TSMC September 2021 Revenue Report

Hsin­chu, Tai­wan, R.O.C. – Oct. 8, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Sep­tem­ber 2021: On a con­so­li­da­ted basis, reve­nue for Sep­tem­ber 2021 was appro­xi­m­ate­ly NT$152.69 bil­li­on, an increase of 11.1 per­cent from August 2021 and an increase of 19.7 per­cent from Sep­tem­ber 2020. Reve­nue for Janu­ary through Sep­tem­ber 2021 tota­led NT$1,149.23 bil­li­on, an increase of 17.5 per­cent com­pared to the same peri­od in 2020.
(…) Wei­ter­le­sen »

Synopsys Accelerates Multi-Die Designs with Industry’s First Complete HBM3 IP and Verification Solutions

HBM3 IP Solu­ti­on Deli­vers Maxi­mum Memo­ry Band­width of 921 GB/s for High-Per­for­mance Com­pu­ting, AI, and Gra­phics SoCs

MOUNTAIN VIEW, Calif.Oct. 7, 2021 /PRNews­wire/ –

High­lights of this Announcement:

  • The Design­Wa­re HBM3 Con­trol­ler, PHY, and Veri­fi­ca­ti­on IP redu­ces inte­gra­ti­on risk and maxi­mi­zes memo­ry per­for­mance in 2.5D mul­ti-die systems
  • Low-laten­cy HBM3 Con­trol­ler with fle­xi­ble con­fi­gu­ra­ti­on opti­ons enhan­ce memo­ry bandwidth
  • Pre-har­den­ed or con­fi­gura­ble HBM3 PHY in 5‑nm pro­cess ope­ra­tes at 7200 Mbps for up to 2X the data rate and impro­ves power effi­ci­en­cy by up to 60% com­pared to HBM2E
  • Veri­fi­ca­ti­on IP and memo­ry models for ZeBu and HAPS offer an end-to-end solu­ti­on for rapid veri­fi­ca­ti­on clo­sure from IP to SoC
  • Syn­op­sys’ 3DIC Com­pi­ler, an inte­gra­ted mul­ti-die design and ana­ly­sis plat­form, pro­vi­des a com­pre­hen­si­ve HBM3 auto-rou­ting solu­ti­on for rapid and robust design development

Syn­op­sys, Inc. (Nasdaq: SNPS) today announ­ced the industry’s first com­ple­te HBM3 IP solu­ti­on, inclu­ding con­trol­ler, PHY, and veri­fi­ca­ti­on IP for 2.5D mul­ti-die packa­ge sys­tems. HBM3 tech­no­lo­gy helps desi­gners meet essen­ti­al high-band­width and low-power memo­ry requi­re­ments for sys­tem-on-chip (SoC) designs tar­ge­ting high-per­for­mance com­pu­ting, AI and gra­phics appli­ca­ti­ons. Syn­op­sys’ Design­Wa­re® HBM3 Con­trol­ler and PHY IP, built on sili­con-pro­ven HBM2E IP, levera­ge Syn­op­sys’ inter­po­ser exper­ti­se to pro­vi­de a low-risk solu­ti­on that enables high memo­ry band­width at up to 921 GB/s.
(…) Wei­ter­le­sen »

Qualcomm Unleashes Wi-Fi Gaming Performance for Windows 11 PCs

Micro­soft Win­dows 11 nati­ve sup­port for Wi-Fi Dual Sta­ti­on, cou­pled with Qual­comm Fast­Con­nect 4‑stream Dual Band Simul­ta­neous and broad indus­try sup­port, enables Gam­ing and PC OEMs to effort­less­ly deli­ver ether­net-like relia­bi­li­ty and latency.

Eco­sys­tem sup­port from Acer, AMD, Leno­vo, Micro­soft, Snapd­ra­gon Com­pu­te Plat­forms and Valve

OCT 5, 2021 SAN DIEGO

Qual­comm Tech­no­lo­gies, Inc., tog­e­ther with eco­sys­tem lea­ders span­ning key plat­forms and OEMs, is set to rede­fi­ne wire­less expec­ta­ti­ons for laten­cy-sen­si­ti­ve gam­ing, pro­duc­ti­vi­ty and lear­ning appli­ca­ti­ons on Window’s 11 PCs with Qual­comm® Fast­Con­nect™ sys­tems. Wi-Fi Dual Sta­ti­on desi­gned using Qual­comm® 4‑Stream Dual Band Simul­ta­neous, harnes­ses mul­ti­ple Wi-Fi bands and anten­nas con­curr­ent­ly, to out­per­form tra­di­tio­nal sin­gle band con­nec­tions.  By simul­ta­neous­ly uti­li­zing the 2.4 GHz and 5 GHz band (or 6 GHz whe­re available), laten­cy issues in one band can be easi­ly resol­ved at a sys­tem-level both quick­ly and trans­par­ent­ly to the end user. (…) Wei­ter­le­sen »

3.5” Single Board Computer with AMD Ryzen™ V2000 Processors

Tai­pei, Tai­wan, Octo­ber 5, 2021 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), pro­vi­der of indus­tri­al mother­boards and embedded sys­tems, has rol­led out the IB952 3.5‑inch SBC that is based on AMD Ryzen™ Embedded V2000 pro­ces­sors built with inno­va­ti­ve 7nm pro­cess tech­no­lo­gy and fea­turing up to 8 cores and 16 threads to pro­vi­de the com­pu­ting per­for­mance and power effi­ci­en­cy for today’s IoT mar­ket. With the inte­gra­ted AMD Rade­on Vega gra­phics, the board can sup­port four dis­plays in 4K reso­lu­ti­on through the onboard inter­faces — dual Dis­play­Po­rt, an eDP, and a 24-bit LVDS dual-chan­nel interface.

Mea­su­ring 102mm x 147mm, the IB952 is packed with fea­tures to dri­ve a diver­se ran­ge of space-limi­t­ed appli­ca­ti­ons in POS, kiosk, digi­tal signage and fac­to­ry auto­ma­ti­on. It comes with two DDR4 SO-DIMM sockets to fit up to 64MB RAM, a wide input vol­ta­ge ran­ge (12V ~ 24V) and two Giga­bit Ether­net for high net­work through­put. The board pro­ces­sor is moun­ted on the under­si­de to allow the heats­ink to occu­py the enti­re foot­print, hel­ping desi­gners crea­te sys­tem housings with effi­ci­ent heat dissipation.

Other fea­tures include a TPM (Trus­ted Plat­form Modu­le) chip for hard­ware-based secu­ri­ty and high-speed peri­phe­ral con­nec­ti­vi­ty with two USB 2.0, three USB 3.1, two SATA III, two seri­al ports, and two M.2 sockets (M‑key/E‑key). Both Win­dows 10 and Linux Ubun­tu ope­ra­ting sys­tems are supported.

IB952 FEATURES:

  • AMD Ryzen™ Embedded V2000 pro­ces­sor on board
  • 2x DDR4 SO-DIMM, Max. 64GB
  • 2x PCI‑E Giga­bit LAN
  • 4Supports 2x Dis­play­Po­rt (DP con­nec­tor and Type‑C), 1x eDP, 1x 24-bit LVDS dual-channel
  • 2x USB2.0, 3x USB3.1, 2x SATA III, 2x COM
  • 2x M.2 sockets (M‑key/ E‑key)

(…) Wei­ter­le­sen »

GlobalFoundries Files Registration Statement for Proposed Initial Public Offering

Mal­ta, NY, Octo­ber 4, 2021 – Glo­bal­Found­ries® (GF®), a glo­bal lea­der in fea­ture-rich semi­con­duc­tor manu­fac­tu­ring, today announ­ced that it has publicly filed a regis­tra­ti­on state­ment on Form F‑1 with the U.S. Secu­ri­ties and Exch­an­ge Com­mis­si­on (the “SEC”) rela­ting to the pro­po­sed initi­al public offe­ring of its ordi­na­ry shares. The num­ber of ordi­na­ry shares to be offe­red and the pri­ce ran­ge for the pro­po­sed offe­ring have not yet been deter­mi­ned. GF has appli­ed to list its ordi­na­ry shares on the Nasdaq Glo­bal Sel­ect Mar­ket under the ticker sym­bol “GFS.”

Mor­gan Stan­ley, BofA Secu­ri­ties, J.P. Mor­gan, Citigroup and Cre­dit Suis­se are acting as acti­ve book-run­ning mana­gers for the pro­po­sed offe­ring. Deut­sche Bank Secu­ri­ties, HSBC and Jef­fe­ries are acting as addi­tio­nal book-run­ning mana­gers for the pro­po­sed offe­ring. Baird, Cowen, Need­ham & Com­pa­ny, Ray­mond James, Wed­bush Secu­ri­ties, Dre­xel Hamil­ton, Sie­bert Wil­liams Shank and IMI – Inte­sa San­pao­lo are acting as co-mana­gers for the pro­po­sed offe­ring. (…) Wei­ter­le­sen »