Kategorie: Pressemitteilungen

Intel Launches Its Most Advanced Performance Data Center Platform

Intel Showcases New 3rd Gen Intel Xeon Scalable – the Only Data Center Processors with Built-In AI; Delivering on Average 46% Increased Performance

NEWS HIGHLIGHTS

  • New 3rd Gen Intel® Xeon® Sca­lable pro­ces­sors — com­bi­ned with Intel’s port­fo­lio of Intel® Opta­ne™ per­sis­tent memo­ry and sto­rage, Ether­net adap­ters, FPGAs and opti­mi­zed soft­ware solu­ti­ons — deli­ver per­for­mance and workload opti­miza­ti­ons across hybrid-cloud, high per­for­mance com­pu­ting (HPC), net­wor­king and intel­li­gent edge applications.
  • New 3rd Gen Intel Xeon Sca­lable pro­ces­sors fea­ture a fle­xi­ble archi­tec­tu­re with inte­gra­ted arti­fi­ci­al intel­li­gence (AI) acce­le­ra­ti­on with Intel® DL Boost tech­no­lo­gy, plus advan­ced secu­ri­ty capa­bi­li­ties to pro­tect data and appli­ca­ti­on code with Intel® Soft­ware Guard Exten­si­on (Intel® SGX) and Intel® Cryp­to Acceleration.
  • New 3rd Gen Intel Xeon Sca­lable pro­ces­sors are rapidly ram­ping, having ship­ped more than 200,000 units for reve­nue in the first quar­ter of 2021 with broad indus­try adop­ti­on across all mar­ket seg­ments, inclu­ding the world’s top cloud ser­vice pro­vi­ders set to deploy ser­vices; more than 250 design wins within 50 uni­que OxM part­ners; more than 15 major tele­com equip­ment manu­fac­tu­r­ers and com­mu­ni­ca­ti­ons ser­vice pro­vi­ders rea­dy­ing POCs and net­wor­king deploy­ments; and over 20 HPC labs and HPC-as-a-ser­vice envi­ron­ments lever­aging our latest Xeon Sca­lable processors.

SANTA CLARA, Calif., April 6, 2021 – Intel today laun­ched its most advan­ced, hig­hest per­for­mance data cen­ter plat­form opti­mi­zed to power the industry’s broa­dest ran­ge of workloads — from the cloud to the net­work to the intel­li­gent edge. New 3rd Gen Intel Xeon Sca­lable pro­ces­sors (code-named “Ice Lake”) are the foun­da­ti­on of Intel’s data cen­ter plat­form, enab­ling cus­to­mers to capi­ta­li­ze on some of the most signi­fi­cant busi­ness oppor­tu­ni­ties today by lever­aging the power of AI. (…) Wei­ter­le­sen »

HETZNER NOW OFFERING AMD EPYC™ 7003 SERIES PROCESSOR POWERED CLOUD SERVERS

Hetz­ner Online is now offe­ring six new models of dedi­ca­ted vCPU cloud ser­vers which are equip­ped with the newest AMD EPYC™ Series pro­ces­sor. AMD EPYC 7003 Series pro­ces­sors offer incre­di­ble per­for­mance and con­ti­nue to rai­se the bar for the modern data center.

In respon­se to high­ly com­pu­te-inten­si­ve requi­re­ments, Hetz­ner Cloud is upgrading and expan­ding its sel­ec­tion of dedi­ca­ted vCPU models with AMD EPYC 7003 Series pro­ces­sors. At the ent­ry level, is the new CCX12, which hou­ses two dedi­ca­ted vCPUs, for the afforda­ble pri­ce of just € 19.90 a month. From the­re, the dedi­ca­ted vCPU count increa­ses: the CCX22 with 4, the CCX32 with 8, the CCX42 with 16, and the CCX52, with 32. For use cases with even hig­her needs, the­re is the CCX62 with a whop­ping 48 dedi­ca­ted vCPUs. This wide ran­ge of models gives cus­to­mers fle­xi­bi­li­ty and sca­la­bi­li­ty: there’s a model sui­ta­ble for every busi­ness requi­re­ment. (…) Wei­ter­le­sen »

AIDA64 v6.33 — AMD Epyc 7003 Optimizations and AMD Radeon RX 6700 Series Support

BUDAPEST, Hun­ga­ry — Mar 30, 2021 — Final­Wire Ltd. today announ­ced the imme­dia­te avai­la­bi­li­ty of AIDA64 Extre­me 6.33 soft­ware, a stream­li­ned dia­gno­stic and bench­mar­king tool for home users; the imme­dia­te avai­la­bi­li­ty of AIDA64 Engi­neer 6.33 soft­ware, a pro­fes­sio­nal dia­gno­stic and bench­mar­king solu­ti­on for cor­po­ra­te IT tech­ni­ci­ans and engi­neers; the imme­dia­te avai­la­bi­li­ty of AIDA64 Busi­ness 6.33 soft­ware, an essen­ti­al net­work manage­ment solu­ti­on for small and medi­um sca­le enter­pri­ses; and the imme­dia­te avai­la­bi­li­ty of AIDA64 Net­work Audit 6.33 soft­ware, a dedi­ca­ted net­work audit tool­set to coll­ect and mana­ge cor­po­ra­te net­work inventories.

The new AIDA64 update intro­du­ces sup­port for AMD Epyc 7003 Series pro­ces­sors, moni­to­ring of Cor­sair RGB Pro XT sen­sor values, and sup­ports the latest AMD and Intel CPU plat­forms as well as the new gra­phics and GPGPU com­pu­ting tech­no­lo­gies by both AMD and nVIDIA.

New features & improvements

  • Enhan­ced sup­port for AMD Epyc 7003 Milan CPU
  • Steel­Se­ries Apex 5 OLED dis­play support
  • Aqua Com­pu­ter High Flow Next sen­sor support
  • Moni­to­ring of Cor­sair H60i, H100i, H115i, H150i RGB Pro XT liquid coolers
  • Impro­ve­ments for Intel B560 and Z590 chip­set based motherboards
  • NZXT Smart Device sen­sor support
  • GPU details for AMD Rade­on RX 6600 and 6700 Series
  • GPU details for nVI­DIA CMP 30HX, CMP 40HX, GeForce GT 1010

(…) Wei­ter­le­sen »

NZXT Announces the N7 B550

March 25th, 2021 – Los Ange­les, CANZXT, a lea­ding desi­gner of com­pu­ter hard­ware, soft­ware, and ser­vices for the PC gam­ing com­mu­ni­ty, today announ­ces the release of the NZXT N7 B550 mother­board, the first AMD mother­board in NZXT’s N7 mother­board lineup. 

 

NZXT is expan­ding the N7 lin­e­up to bring the sleek, seam­less design of the N7 ATX mother­board to more gamers. The N7 B550 has opti­mal­ly pla­ced port loca­ti­ons, sup­ports the latest tech­no­lo­gy like PCIe gen 4 and WiFi 6e, and gives PC buil­ders the tools they need to crea­te a beau­tiful­ly modern build. 

 

(…) Wei­ter­le­sen »

Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications

512GB capa­ci­ty DDR5 modu­le made pos­si­ble by an 8‑layer TSV structure
HKMG mate­ri­al redu­ces power by 13 per­cent while doubling the speed of DDR4

Sam­sung Elec­tro­nics, the world lea­der in advan­ced memo­ry tech­no­lo­gy, today announ­ced that it has expan­ded its DDR5 DRAM memo­ry port­fo­lio with the industry’s first 512GB DDR5 modu­le based on High‑K Metal Gate (HKMG) pro­cess tech­no­lo­gy. Deli­ve­ring more than twice the per­for­mance of DDR4 at up to 7,200 mega­bits per second (Mbps), the new DDR5 will be capa­ble of orchest­ra­ting the most extre­me com­pu­te-hun­gry, high-band­width workloads in super­com­pu­ting, arti­fi­ci­al intel­li­gence (AI) and machi­ne lear­ning (ML), as well as data ana­ly­tics appli­ca­ti­ons. (…) Wei­ter­le­sen »

Intel Provides Financial Update and Full-year Business Outlook

Expects Full-year 2021 Non-GAAP Reve­nue of $72 bil­li­on and Non-GAAP EPS of $4.55

SANTA CLARA, Calif., March 23, 2021 — Intel Cor­po­ra­ti­on today pro­vi­ded a finan­cial update and full-year 2021 busi­ness outlook.

The com­pa­ny expects to exceed its pre­vious­ly com­mu­ni­ca­ted first-quar­ter 2021 non-GAAP reve­nue and ear­nings-per-share (EPS) gui­dance, dri­ven by con­tin­ued strong note­book demand.

For the full year, Intel expects con­tin­ued strong PC demand with dou­ble-digit PC TAM per­cen­ta­ge growth. Intel cli­ent CPU sup­p­ly is also expec­ted to be up dou­ble-digits year-over-year. Howe­ver, PC reve­nue will be tem­pe­red by the indus­try-wide shorta­ge of cri­ti­cal third-par­ty com­pon­ents, such as sub­stra­tes, which the com­pa­ny is working with its sup­p­ly chain part­ners to miti­ga­te. Intel’s full-year busi­ness out­look also reflects enti­ty list uncer­tain­ty. (…) Wei­ter­le­sen »

Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing, Innovation and Product Leadership

SANTA CLARA, Calif., March 23, 2021 – Today, Intel CEO Pat Gel­sin­ger out­lined the company’s path for­ward to manu­fac­tu­re, design and deli­ver lea­der­ship pro­ducts and crea­te long-term value for stake­hol­ders. During the company’s glo­bal “Intel Unleas­hed: Engi­nee­ring the Future” web­cast, Gel­sin­ger shared his visi­on for “IDM 2.0,” a major evo­lu­ti­on of Intel’s inte­gra­ted device manu­fac­tu­ring (IDM) model. Gel­sin­ger announ­ced signi­fi­cant manu­fac­tu­ring expan­si­on plans, start­ing with an esti­ma­ted $20 bil­li­on invest­ment to build two new fac­to­ries (or “fabs”) in Ari­zo­na. He also announ­ced Intel’s plans to beco­me a major pro­vi­der of foundry capa­ci­ty in the U.S. and Euro­pe to ser­ve cus­to­mers glo­bal­ly. (…) Wei­ter­le­sen »

Announcing Oracle Cloud Compute E4 platform on third gen AMD EPYC processors

At Ora­cle Open­World 2018, we announ­ced a stra­te­gic part­ner­ship with AMD and laun­ched the Ora­cle E2 plat­form on the first gene­ra­ti­on of AMD EPYC pro­ces­sors. Sin­ce that launch, we’ve deploy­ed Ora­cle E2 Com­pu­te ins­tances to all of our com­mer­cial regi­ons. Eigh­te­en months later, in April 2020, we built on this part­ner­ship and laun­ched the E3 plat­form on the second gene­ra­ti­on. Many of our enter­pri­se cus­to­mers and Ora­cle Cloud appli­ca­ti­ons are run­ning gene­ral-pur­po­se workloads on AMD EPYC pro­ces­sors. Today, I’m hap­py to announ­ce that Ora­cle is laun­ching the E4 plat­form based on third-gene­ra­ti­on AMD EPYC pro­ces­sors. The E4 plat­form includes both bare metal and fle­xi­ble vir­tu­al machi­nes (VMs). (…) Wei­ter­le­sen »

ASUS Announces All-New AMD EPYC 7003 Series Servers to Drive Performance and Value for Modern Data Centers

TAIPEI, Tai­wan, March 15, 2021 — ASUS, the lea­ding IT com­pa­ny in ser­ver sys­tems, ser­ver mother­boards and work­sta­tions, today announ­ced the intro­duc­tion of a com­pre­hen­si­ve ser­ver port­fo­lio based on the latest AMD EPYC™ 7003 series processors.
The all-new offe­rings fea­ture both dual-socket and sin­gle-socket ser­vers in 4U, 2U and 1U chas­sis with new archi­tec­tu­re, chas­sis and modu­lar design to impro­ve sys­tem fle­xi­bi­li­ty and sca­la­bi­li­ty. They also deli­ver sup­port for the latest PCI Express® (PCIe®) 4.0, OCP 3.0 and BMC tech­no­lo­gies to dri­ve lea­ding per­for­mance and impro­ved TCO with bet­ter ser­ver performance.

  • AMD EPYC 7003-based ser­ver portfolio

The new ASUS RS720A, RS700A, RS520A and RS500A-E11 series ser­vers offer refres­hed designs based on both dual-socket and sin­gle-socket AMD EPYC 7003 series pro­ces­sors. ASUS will also offer BIOS updates to enable ser­vers based on pre­vious-gene­ra­ti­on EPYC 7002 pro­ces­sors, inclu­ding ESC4000A-E10, RS620SA-E10-RS12 and RS500A-E10 series, to levera­ge all the fea­tures of this new gene­ra­ti­on, ensu­ring impro­ved and con­sis­tent per­for­mance, as well as com­pa­ti­bi­li­ty with the latest AMD platforms.
This new ran­ge will be bols­te­red by forth­co­ming ASUS ESC series GPU ser­vers in 4U chas­sis to sup­port up to eight NVIDIA GPUs or Xilinx FPGA acce­le­ra­tor cards in a sin­gle sys­tem, and opti­mi­zed for AI, deep lear­ning and HPC workloads. A com­ple­te list of all ASUS ser­ver pro­ducts is available at:

https://www.asus.com/Commercial-Servers-Workstations (…) Wei­ter­le­sen »

Dell Technologies Powers AI and Edge Computing with Next Generation PowerEdge Servers

ROUND ROCK, Texas – March 17, 2021 — 

Dell Tech­no­lo­gies (NYSE:DELL) ushers in the next gene­ra­ti­on of com­pu­ting with its most powerful and secu­re Dell EMC PowerEdge ser­ver port­fo­lio. With the new ser­vers, Dell Tech­no­lo­gies is char­ting the path toward auto­no­mous infra­struc­tu­re to offer grea­ter IT effi­ci­en­cy, embrace AI and address the demands of IT at the edge.

The world’s best-sel­ling ser­ver portfolio2 pro­vi­des the power nee­ded to gain and act on real-time insights from data whe­re­ver it may reside—from core data cen­ters to public clouds and edge loca­ti­ons. Reim­agi­ned with 17 new PowerEdge ser­vers and bols­te­red by 1,100 Dell-owned or filed U.S. patents, the new ser­vers deli­ver their hig­hest per­for­mance to date.

Data is being crea­ted and used in more places than ever befo­re, and orga­niza­ti­ons are chal­len­ged to act on it as quick­ly as pos­si­ble,” said Jeff Bou­d­reau, pre­si­dent and gene­ral mana­ger, Infra­struc­tu­re Solu­ti­ons Group at Dell Tech­no­lo­gies. “As we inno­va­te for the future of IT, advan­ced auto­ma­ti­on is a must, no mat­ter whe­re infra­struc­tu­re resi­des. Our new PowerEdge ser­vers offer next-level per­for­mance to help cus­to­mers acce­le­ra­te data insights and the move toward auto­no­mous compute.”

Auto­no­mous com­pu­te helps cus­to­mers ful­ly rea­li­ze self-deploy­ed, self-pro­vi­sio­ned and self-mana­ged infra­struc­tu­re in the future. Today, through Dell EMC Open­Ma­na­ge Enter­pri­se, PowerEdge ser­vers and sys­tems manage­ment can deli­ver up to 85% time savings on avera­ge and eli­mi­na­te dozens of steps with automation.3 (…) Wei­ter­le­sen »

GIGABYTE veröffentlicht die AORUS Radeon™ RX 6700 XT ELITE Grafikkarte

Die Magie des Lichts – das klas­si­sche Design mit drei RGB Rin­gen ist zurück

Tai­peh, Tai­wan, GIGABYTE TECHNOLOGY Co. Ltd, einer der füh­ren­den Her­stel­ler von Pre­mi­um Gam­ing Hard­ware, hat die neue AMD Rade­on™ RX 6700 XT Gra­fik­kar­te ange­kün­digt. Die AORUS Rade­on™ RX 6700 XT ELITE 12G basiert auf der AMD RDNA™2 Gam­ing Archi­tek­tur und ver­fügt über das klas­si­sche Design mit drei RGB-Rin­gen und Beleuch­tungs­ef­fek­ten. Das Licht wird von den Licht­quel­len aus intern wei­ter­ge­lei­tet, wodurch ein hel­le­rer und natür­li­che­rer RGB-Effekt erreicht wird. So ent­steht eine fan­tas­ti­sche Balan­ce aus Küh­lung und RGB-Beleuchtung.

Die AORUS Rade­on™ RX 6700 XT ELITE bleibt dabei jedoch nicht nur dem Design-Sche­ma der Vor­gän­ger treu, son­dern unter­streicht durch den klas­si­schen, iko­ni­schen Stil auch ihren Wie­der­erken­nungs­wert, wäh­rend sie die von moder­ner Gam­ing Hard­ware gewohn­ten Ele­men­te neu defi­niert. Außer­dem haben Nut­zer nun noch mehr Frei­heit, die Beleuch­tung ein­zig­ar­tig anzu­pas­sen, und über die RGB Fusi­on 2.0 Soft­ware kön­nen mit acht ver­schie­de­nen Farb­kom­bi­na­tio­nen beein­dru­cken­de Effek­te erzeugt werden.

(…) Wei­ter­le­sen »

Intel to Launch 3rd Gen Intel Xeon Scalable Portfolio

SANTA CLARA, Calif., March 22, 2021 – Join Intel’s Navin She­noy, exe­cu­ti­ve vice pre­si­dent in the Data Plat­forms Group, and Lisa Spel­man, cor­po­ra­te vice pre­si­dent in the Xeon and Memo­ry Group, on April 6 for the launch of the latest 3rd Gen Intel® Xeon® Sca­lable pro­ces­sors (code-named “Ice Lake”) and the latest addi­ti­ons to Intel’s hard­ware and soft­ware port­fo­lio tar­ge­ting data cen­ters, 5G net­works and intel­li­gent edge infrastructure.

The vir­tu­al “How Won­derful Gets Done 2021” launch event will fea­ture Intel exe­cu­ti­ves and eco­sys­tem part­ners addres­sing some of today’s grea­test busi­ness oppor­tu­ni­ties. The event will also include brief remarks by Intel Chief Exe­cu­ti­ve Offi­cer Pat Gel­sin­ger. (…) Wei­ter­le­sen »

Geballte Gaming-Power: ROG Zephyrus Duo 15 SE und ROG Zephyrus G15 ab sofort erhältlich

Ratin­gen, 18. März 2021 – Ab sofort sind zwei neue ROG Note­books in Deutsch­land im Han­del erhält­lich: Das ROG Zephy­rus Duo 15 SE bie­tet mit dem gro­ßen Zweit­dis­play, das ober­halb der Tas­ta­tur inte­griert ist und sich beim Öff­nen des Note­books nach oben neigt, zusätz­li­che Bild­schirm­flä­che für eine kom­for­ta­ble­re Anzei­ge und bes­se­res Mul­ti­tas­king. Das ROG Zephy­rus G15 mit 180°-Flip-Scharnier ist ein mobi­ler Beglei­ter, mit der Leis­tung der neu­es­ten AMD Ryzen Pro­zes­so­ren und NVIDIA GeForce RTX 30er Gra­fik in einem 19,9 mm dün­nen und 1,9 Kilo­gramm leich­ten Gehäu­se. (…) Wei­ter­le­sen »

ASRock Rack Announces The Broadest Compatibility of AMD EPYC™ 7003 Series Processor Solutions for Breakthrough Performance

Tai­pei, Tai­wan – March 16 , 2021 – ASRock Rack Inc., spe­cia­li­zed in the field of high per­for­mance cloud com­pu­ting ser­ver hard­ware, desi­gned to meet the huge demand for more com­pu­te in big data ana­ly­tics, HPC and cloud com­pu­ting of enti­re port­fo­lio of new ser­ver solu­ti­ons ful­ly sup­ports the new­ly announ­ced high-fre­quen­cy AMD EPYC™ 7003 Series pro­ces­sors. (…) Wei­ter­le­sen »