Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations

Verfasst vonpipin

What’s New:
Intel Cor­po­ra­ti­on will invest $3.5 bil­li­on to equip its New Mexi­co ope­ra­ti­ons for the manu­fac­tu­ring of advan­ced semi­con­duc­tor pack­a­ging tech­no­lo­gies, inclu­ding Fove­r­os, Intel’s breakth­rough 3D pack­a­ging tech­no­lo­gy. The mul­ti­year invest­ment is expec­ted to crea­te at least 700 high-tech jobs and 1,000 con­s­truc­tion jobs and sup­port an addi­tio­nal 3,500 jobs in the sta­te. Plan­ning acti­vi­ties begin imme­dia­te­ly, with con­s­truc­tion expec­ted to start in late 2021.

“A key dif­fe­ren­tia­tor for our IDM 2.0 stra­tegy is our unques­tio­ned lea­der­ship in advan­ced pack­a­ging, which allows us to mix and match com­pu­te tiles to deli­ver the best pro­ducts. We’re see­ing tre­men­dous inte­rest in the­se capa­bi­li­ties from the indus­try, espe­ci­al­ly fol­lo­wing the intro­duc­tion of our new Intel Foundry Ser­vices. We’re proud to have inves­ted in New Mexi­co for more than 40 years and we see our Rio Rancho cam­pus con­ti­nuing to play a cri­ti­cal role in Intel’s glo­bal manu­fac­tu­ring net­work in our new era of IDM 2.0.”

Key­van Esfar­ja­ni, Intel seni­or vice pre­si­dent and gene­ral mana­ger of Manu­fac­tu­ring and Ope­ra­ti­on (…) Wei­ter­le­sen »

Hewlett Packard Enterprise Selected to Build New Supercomputer for the National Supercomputing Centre Singapore to Support Scientific Research

Verfasst vonpipin

Natio­nal Super­com­pu­ting Cent­re (NSCC) Sin­ga­po­re advan­ces R&D across bio­me­di­ci­ne, geno­mics, dise­a­ses, cli­ma­te and more with an 8X fas­ter sys­tem powered by the HPE Cray EX supercomputer

April 27, 2021 10:00 PM Eas­tern Day­light Time

HOUSTON–(BUSINESS WIRE)–Hew­lett Packard Enter­pri­se (NYSE: HPE) today announ­ced it has been award­ed $40M SGD to build a new super­com­pu­ter for the Natio­nal Super­com­pu­ting Cent­re (NSCC) Sin­ga­po­re, the natio­nal high-per­for­mance com­pu­ting (HPC) resour­ce cen­ter dedi­ca­ted to sup­port­ing sci­ence and engi­nee­ring com­pu­ting needs for aca­de­mic, rese­arch and indus­try com­mu­ni­ties. The new sys­tem, which will be 8X fas­ter com­pared to NSCC’s exis­ting pool of HPC resour­ces, will expand and aug­ment ongo­ing rese­arch efforts by enab­ling tools such as arti­fi­ci­al intel­li­gence (AI) and deep machi­ne lear­ning to opti­mi­ze mode­ling, simu­la­ti­on and even soft­ware simu­la­ti­on for quan­tum com­pu­ting. NSCC will use the sys­tem to unlock sci­en­ti­fic dis­co­veries across medi­ci­ne, dise­a­ses, cli­ma­te, engi­nee­ring and more. (…) Wei­ter­le­sen »

AMD Reports First Quarter 2021 Financial Results

Verfasst vonpipin

— Reve­nue grew 93 per­cent while net inco­me and EPS tri­pled year-over-year —

SANTA CLARA, Calif., April 27, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the first quar­ter of 2021 of $3.45 bil­li­on, ope­ra­ting inco­me of $662 mil­li­on, net inco­me of $555 mil­li­on and diluted ear­nings per share of $0.45. On a non-GAAP* basis, ope­ra­ting inco­me was $762 mil­li­on, net inco­me was $642 mil­li­on and diluted ear­nings per share was $0.52.

GAAP Quar­ter­ly Finan­cial Results

(…) Wei­ter­le­sen »

Xilinx Announces Full Production Shipments of 7nm Versal AI Core and Versal Prime Series Devices

Verfasst vonpipin

Ver­sal Pre­mi­um series also hits mile­stone with first ship­ments to ear­ly access customers

SAN JOSE, Calif.–(BUSINESS WIRE)– Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today announ­ced that its Ver­sal™ AI Core and Ver­sal Prime series devices are now ship­ping to cus­to­mers in full pro­duc­tion volu­mes. Addi­tio­nal­ly, the third series in the Ver­sal port­fo­lio, Ver­sal Pre­mi­um, has now ship­ped to mul­ti­ple tier-one cus­to­mers through the company’s ear­ly access pro­gram. Ver­sal is the industry’s first adap­ti­ve com­pu­te acce­le­ra­ti­on plat­form (ACAP). Ver­sal ACAPs com­bi­ne sca­lar pro­ces­sing engi­nes, adap­ta­ble hard­ware engi­nes, intel­li­gent engi­nes with lea­ding-edge memo­ry and inter­fa­cing tech­no­lo­gies to deli­ver powerful hete­ro­ge­neous acce­le­ra­ti­on for any appli­ca­ti­on bey­ond the capa­bi­li­ties of an FPGA. (…) Wei­ter­le­sen »

Intel Reports First-Quarter 2021 Financial Results

Verfasst vonpipin

News Sum­ma­ry

>First-quar­ter GAAP reve­nue of $19.7 bil­li­on, down 1 per­cent year over year (YoY), and non-GAAP reve­nue of $18.6 bil­li­on, flat YoY, which excee­ded Janu­ary gui­dance by $1.1 billion.

▪       First-quar­ter GAAP ear­nings-per-share (EPS) was $0.82; non-GAAP EPS was $1.39, which excee­ded Janu­ary gui­dance by $0.29.

▪       In Q1, Intel CEO Pat Gel­sin­ger unvei­led the company’s new, dif­fe­ren­tia­ted IDM 2.0 stra­tegy for manu­fac­tu­ring, inno­va­ti­on and pro­duct leadership.

▪       Rai­sing full-year 2021 gui­dance. Now expec­ting GAAP reve­nue of $77.0 bil­li­on and non-GAAP reve­nue of $72.5 bil­li­on; GAAP EPS of $4.00 and non-GAAP EPS of $4.60.1

SANTA CLARA, Calif., April 22, 2021 — Intel Cor­po­ra­ti­on today repor­ted first-quar­ter 2021 finan­cial results.

“Intel deli­ver­ed strong first-quar­ter results dri­ven by excep­tio­nal demand for our lea­der­ship pro­ducts and out­stan­ding exe­cu­ti­on by our team. The respon­se to our new IDM 2.0 stra­tegy has been extra­or­di­na­ry, our pro­duct road­map is gai­ning momen­tum, and we’re rapidly pro­gres­sing our plans with re-invi­go­ra­ted focus on inno­va­ti­on and exe­cu­ti­on,” said Pat Gel­sin­ger, Intel CEO. “This is a pivo­tal year for Intel. We are set­ting our stra­te­gic foun­da­ti­on and inves­t­ing to acce­le­ra­te our tra­jec­to­ry and capi­ta­li­ze on the explo­si­ve growth in semi­con­duc­tors that power our incre­asing­ly digi­tal world.”
(…) Wei­ter­le­sen »

HLRS RECEIVES DONATION TO SUPPORT COVID-RELATED RESEARCH AND URGENT COMPUTING

Verfasst vonpipin

19 April 2021-Com­pu­ting hard­ware manu­fac­tu­rer AMD has dona­ted 10 ser­ver sys­tems to the High-Per­for­mance Com­pu­ting Cen­ter Stutt­gart (HLRS) that will be dedi­ca­ted for rese­arch rela­ted to the SARS-CoV‑2 pan­de­mic. The new resour­ces, which were deli­ver­ed this week, will also expand HLRS’s capa­ci­ty to address future urgent com­pu­ting needs.

The dona­ti­on comes as part of the AMD COVID-19 High Per­for­mance Com­pu­ting Fund, which was estab­lished in April 2020 to pro­vi­de rese­arch insti­tu­ti­ons around the world with com­pu­ting resour­ces to acce­le­ra­te medi­cal rese­arch on COVID-19 and other dise­a­ses. HLRS is among the first Euro­pean HPC cen­ters to recei­ve a dona­ti­on under pha­se two of this program.

The new AMD nodes will be inte­gra­ted into HLRS’s Vul­can clus­ter. Each of the dona­ted ser­vers con­ta­ins one AMD EPYC™ pro­ces­sor and eight AMD Instinct™ acce­le­ra­tors, which are opti­mi­zed for appli­ca­ti­ons invol­ving machi­ne lear­ning, deep lear­ning, and arti­fi­ci­al intel­li­gence. The ser­ver sys­tems, built by Pen­gu­in Com­pu­ting, will offer 530 TFlops of 64-bit floa­ting-point performance.

(…) Wei­ter­le­sen »

Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge

Verfasst vonpipin

Apr 20, 2021

Pro­duc­tion-rea­dy embedded boards and low-cost deve­lo­per kit acce­le­ra­te design cycles for rapid deploy­ment; initi­al pro­ducts tar­get visi­on AI appli­ca­ti­ons in smart cities and factories

SAN JOSE, Calif.–(BUSINESS WIRE)– Xilinx, Inc. (NASDAQ: XLNX) today intro­du­ced the Kria™ port­fo­lio of adap­ti­ve sys­tem-on-modu­les (SOMs), pro­duc­tion-rea­dy small form fac­tor embedded boards that enable rapid deploy­ment in edge-based appli­ca­ti­ons. Cou­pled with a com­ple­te soft­ware stack and pre-built, pro­duc­tion-gra­de acce­le­ra­ted appli­ca­ti­ons, Kria adap­ti­ve SOMs are a new method of brin­ging adap­ti­ve com­pu­ting to AI and soft­ware deve­lo­pers. (…) Wei­ter­le­sen »

Latest AMD Radeon Software Release Expands Remote Gaming Functionality and Enables New Features and Customization Capabilities

Verfasst vonpipin

– AMD Rade­on Soft­ware Adre­na­lin 21.4.1 pro­vi­des cus­to­mizable instal­la­ti­on opti­ons, enhan­ced recor­dingand strea­ming func­tion­a­li­ty, Play­Re­a­dy AV1 sup­port and new sta­bi­li­ty features –

– AMD Link now enables high-per­for­mance remo­te gam­ing on Win­dows PCs in addi­ti­on to pho­nes, tablets and TVs; new AMD Link Game fea­ture allows ano­ther Rade­on user to remo­te­ly con­nect to play local mul­ti­play­er-sup­port­ed games –

SANTA CLARA, Calif. – April 20, 2021 – AMD (NASDAQ: AMD) today announ­ced AMD Rade­on™ Soft­ware Adre­na­lin 21.4.1, the next edi­ti­on of its soft­ware suite for AMD Rade­on gra­phics, pro­vi­ding gamers, crea­tors and enthu­si­asts with incre­di­ble visu­al fide­li­ty, ultra-respon­si­ve gam­ing and advan­ced fea­tures to unlock the full poten­ti­al of their AMD gam­ing expe­ri­ence. (…) Wei­ter­le­sen »

ROG Strix XF 120 – der Lüfter von ASUS ROG ist ab sofort erhältlich

Verfasst vonpipin

Der 120 mm PWM-Lüf­ter lie­fert eine opti­ma­le Kom­bi­na­ti­on aus Luft­strom und sta­ti­schem Druck für den Ein­satz als PC-Gehäu­se‑, Radia­tor- oder CPU-Kühlerlüfter.

Mag­Lev-Lager: Sta­bi­li­siert den Lüf­ter­ro­tor für gerin­ge­re Rei­bung und Geräusch­ent­wick­lung; bie­tet eine Lebens­dau­er von 400.000 Stunden

Rah­men und Lüf­ter­blät­ter mit aero­dy­na­mi­schem Design: Mini­miert Tur­bu­len­zen und maxi­miert den Luftstrom

Ultra-lei­ses Pro­fil: Bie­tet eine geräusch­ar­me Kühl­leis­tung von 22,5 dB(A); Anti-Vibra­ti­ons-Pads und Hal­te­run­gen redu­zie­ren Vibra­tio­nen und Geräu­sche weiter.

Ratin­gen, Deutsch­land, 20. April 2021 — Der ROG Strix XF 120, ein 120-mm-4-Pin-PWM-Lüf­ter (Pul­se-Width-Modu­la­ti­on), der ultra-lei­se Akus­tik­pro­fi­le für eine Rei­he von Leis­tungs­an­for­de­run­gen und Anwen­dun­gen bie­tet, ist ab sofort erhält­lich. Er lie­fert die opti­ma­le Kom­bi­na­ti­on aus Luft­strom (bis zu 106,19 Kubik­me­ter pro Minu­te) und sta­ti­schem Druck (bis zu 3,07 mm H2O) und bie­tet damit Fle­xi­bi­li­tät für den Ein­satz in Gehäu­se­küh­lun­gen oder Anwen­dun­gen mit sta­ti­schem Druck, ein­schließ­lich als Radia­tor- oder CPU-Lüf­ter. Mit einem umfang­rei­chen Betriebs­be­reich von 250 bis 1800 U/min bie­tet der Lüf­ter die Prä­zi­si­on, sich auf bis zu 250 U/min ein­zu­stel­len. Außer­dem schal­tet sich der Lüf­ter auto­ma­tisch ab, wenn er auf 0 % PWM ein­ge­stellt wird, um ein ultral­ei­ses Geräusch­pro­fil bei gerin­ge­rer Arbeits­last zu errei­chen. (…) Wei­ter­le­sen »

TSMC Reports First Quarter EPS of NT$5.39

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Hsin­chu, Tai­wan, R.O.C., Apr. 15, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$362.41 bil­li­on, net inco­me of NT$139.69 bil­li­on, and diluted ear­nings per share of NT$5.39 (US$0.96 per ADR unit) for the first quar­ter ended March 31, 2021.

Year-over-year, first quar­ter reve­nue increased 16.7% while net inco­me and diluted EPS both increased 19.4%. Com­pared to fourth quar­ter 2020, first quar­ter results repre­sen­ted a 0.2% increase in reve­nue and a 2.2% decrease in net inco­me. All figu­res were pre­pared in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, first quar­ter reve­nue was $12.92 bil­li­on, which increased 25.4% year-over-year and increased 1.9% from the pre­vious quar­ter. (…) Wei­ter­le­sen »

BIOSTAR ANNOUNCES THE NEW B550T-SILVER MOTHERBOARD

Verfasst vonNero24

SMALL MOTHERBOARD WITH BIG FEATURES

April 15th, 2021, Tai­pei, Tai­wan — BIOSTAR, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and sto­rage devices today, unveils the brand new B550T-SILVER motherboard.

Built to run the latest AMD Ryzen pro­ces­sors on AMD’s B550 sin­gle chip archi­tec­tu­re, the new B550T-SILVER mother­board from BIOSTAR is tru­ly a mas­ter­pie­ce in design and engi­nee­ring. With all the essen­ti­als for a mother­board of its kind, this Mini-ITX mother­board is ver­sa­ti­le for any occa­si­on.  (…) Wei­ter­le­sen »

CORSAIR präsentiert die neuen Gaming-PCs CORSAIR ONE a200 mit AMD Ryzen 5000-Serie und CORSAIR ONE i200 mit Intel Core 11. Gen.

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Sys­te­me ver­fü­gen über NVIDIA GeForce RTX 3080-Gra­fik­kar­te für High-End-Anfor­de­run­gen bei Gam­ing und Streaming

 

FREMONT, Kali­for­ni­en (USA), 13. April 2021 – CORSAIR, ein welt­weit füh­ren­der Anbie­ter von Hoch­leis­tungs­sys­te­men und ‑aus­rüs­tung für Gamer, Con­tent Crea­tors und PC-Enthu­si­as­ten, hat heu­te die Ein­füh­rung von aktua­li­sier­ten Kon­fi­gu­ra­tio­nen für sei­ne Top-Pro­dukt­li­nie an kom­pak­ten Gam­ing-PCs ange­kün­digt: CORSAIR ONE a200 und CORSAIR ONE i200. Bei­de Sys­te­me bie­ten extrem hohe Geschwin­dig­kei­ten dank der neu­es­ten Pro­zes­so­ren auf dem Markt – dem AMD Ryzen 9 5900X und dem Intel Core bis i9-11900K – gepaart mit der immensen Leis­tung und Geschwin­dig­keit der NVIDIA GeForce RTX 3080-Gra­fi­kar­te. Und wie immer unter­stützt jeder CORSAIR ONE auch die vol­le Palet­te an preis­ge­krön­ten COR­SAIR-Kom­po­nen­ten mit ihrem unglaub­lich kom­pak­ten und ein­zig­ar­ti­gen Formfaktor.
(…) Wei­ter­le­sen »

be quiet! stellt modulare Pure Power 11 FM Netzteile sowie überarbeitete Modelle im SFX- und TFX-Format vor

Verfasst vonpipin

Drei neue Main­stream-Netz­teil­se­ri­en ermög­li­chen viel­sei­ti­ge und effi­zi­en­te Builds in Full-Size oder Kompaktgehäusen

Glin­de, 13. April 2021 — be quiet!, seit 2017 der Markt­füh­rer für PC-Netz­tei­le in Deutsch­land, kün­digt drei neue Netz­teil­se­ri­en an. Das Pure Power 11 FM ist eine voll­stän­dig modu­la­re Ver­si­on des bekann­ten Pure Power 11. Die Netz­tei­le sind mit einer Leis­tung von 550, 650 und 750 Watt erhält­lich und rich­ten sich an Main­stream-Com­pu­ter­an­wen­der, wel­che die Viel­sei­tig­keit modu­la­rer Kabel und die 80 PLUS® Gold-Effi­zi­enz von bis zu 93,9 Pro­zent schät­zen. Für Fans von Small-Form-Fac­tor-Gehäu­sen, die eine hohe Leis­tung im kom­pak­ten SFX- oder TFX-Form­fak­tor benö­ti­gen, hat be quiet! jetzt die Seri­en SFX Power 3 und TFX Power 3 im Pro­gramm. (…) Wei­ter­le­sen »

AMD and Xilinx Stockholders Overwhelmingly Approve AMD’s Acquisition of Xilinx

Verfasst vonpipin

SILICON VALLEY, Calif. 04/07/2021

AMD (NASDAQ:AMD) and Xilinx, Inc (NASDAQ:XLNX) announ­ced today that stock­hol­ders voted to appro­ve their respec­ti­ve pro­po­sals rela­ting to the pen­ding acqui­si­ti­on of Xilinx by AMD. The acqui­si­ti­on will bring tog­e­ther two indus­try lea­ders with com­ple­men­ta­ry pro­duct port­fo­li­os and cus­to­mers, com­bi­ning CPUs, GPUs, FPGAs, Adap­ti­ve SoCs and deep soft­ware exper­ti­se to enable lea­der­ship in com­pu­ting plat­forms for cloud, edge and end devices. Tog­e­ther, the com­bi­ned com­pa­ny will have the abili­ty to capi­ta­li­ze on oppor­tu­ni­ties span­ning some of the industry’s most important growth seg­ments, inclu­ding data cen­ters, gam­ing, PCs, com­mu­ni­ca­ti­ons, auto­mo­ti­ve, indus­tri­al, aero­space and defen­se. (…) Wei­ter­le­sen »