Kategorie: News

AMD Ryzen 7 5800X3D ab heute für knapp 500 EUR verfügbar

Seit Mai letz­ten Jah­res war die Tech­nik des 3D-V-Cache ange­kün­digt, zwi­schen­zeit­lich mal anhand eines Ryzen‑9–5900-Prototypen gezeigt und wäh­rend­des­sen im Ser­ver­seg­ment als Milan‑X schon ein­ge­führt. Bereits für Ende 2021 als Kon­ter für den Intel Alder Lake erwar­tet, fehl­te immer noch das Pen­dant für den Desk­top. (…) Wei­ter­le­sen »

AMD EPYC™ Processors Power New Oracle Cloud Infrastructure Compute Instances and Enable Hybrid Cloud Environment

— New Ora­cle Cloud Infra­st­ruc­tu­re E4 Den­se com­pu­te instan­ces, com­bi­ned with VMware® Cloud solu­ti­ons, expands AMD EPYC pro­ces­sor foot­print into hybrid cloud environments —

SANTA CLARA, Calif., April 20, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the expan­si­on of the AMD EPYC™ pro­ces­sor foot­print wit­hin the cloud eco­sys­tem, powe­ring the new Ora­cle Cloud Infra­st­ruc­tu­re (OCI) E4 Den­se instan­ces. The­se new instan­ces are part of the Ora­cle Cloud VMware Solu­ti­on offe­rings, enab­le cus­to­mers to build and run a hybrid-cloud envi­ron­ment for their VMware® based workloads. (…) Wei­ter­le­sen »

AMD EPYC Processors Deliver Competitive Computing Edge to Mercedes-AMG Petronas Formula One Racing Team

AMD EPYC™ processors push boundaries in aerodynamic testing, cutting CFD workload time in half by delivering 20 percent improvement for eight-time Constructors’ Champions

SANTA CLARA, Calif., April 19, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) and the Mer­ce­des-AMG Petro­nas For­mu­la One (F1) Team today show­ca­sed how AMD EPYC pro­ces­sors impro­ved aero­dy­na­mics tes­ting capa­ci­ty, con­tri­bu­ting to the Mer­ce­des-AMG Petro­nas team win­ning its eighth Con­struc­tors’ Cham­pions­hip in the 2021 racing sea­son. By using AMD EPYC pro­ces­sors, the team was able to achie­ve a 20 per­cent per­for­mance impro­ve­ment for com­pu­ta­tio­nal flu­id dyna­mics (CFD) workloads that were used to model and test aero­dy­na­mic flow of their F1 car.

(…) Wei­ter­le­sen »

Hasmukh Ranjan Appointed AMD Chief Information Officer

Fol­lowing acqui­si­ti­on of Xilinx, AMD appoints Has­mukh Ran­jan to Seni­or Vice Pre­si­dent and Chief Infor­ma­ti­on Officer

SANTA CLARA, Calif., April 18, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the appoint­ment of Has­mukh Ran­jan to AMD seni­or vice pre­si­dent and Chief Infor­ma­ti­on Offi­cer (CIO), effec­ti­ve immedia­te­ly. Ran­jan pre­vious­ly ser­ved as CIO at Xilinx. Ran­jan leads the glo­bal IT orga­niz­a­ti­on, respon­si­ble for pro­vi­ding stra­te­gic over­sight of cor­po­ra­te IT infra­st­ruc­tu­re; main­tai­ning cri­ti­cal tech­no­lo­gy app­li­ca­ti­ons and sys­tems; and deli­vering advan­ced solu­ti­ons to enab­le more secu­re and pro­duc­ti­ve busi­ness ope­ra­ti­ons. (…) Wei­ter­le­sen »

AMD to Report Fiscal First Quarter 2022 Financial Results

SANTA CLARA, Calif., April 14, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that it will report first quar­ter 2022 finan­cial results on Tues­day, May 3, 2022, after the clo­se of mar­ket. Manage­ment will con­duct a con­fe­rence call to dis­cuss the­se results at 5:00 p.m. EST / 2:00 p.m. PST. Inte­res­ted par­ties are invi­ted to lis­ten to the web­cast of the con­fe­rence call via AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.

(…) Wei­ter­le­sen »

AMD stellt Ryzen PRO 6000 Mobile Prozessoren vor

Bereits zur CES im Janu­ar hat­te AMD die Ryzen 6000 Mobi­le Pro­zes­so­ren (“Rem­brandt”) vor­ge­stellt und heu­te fol­gen 8 Model­le der PRO-Vari­an­te für Busi­ness­kun­den. Die­se tei­len sich auf in drei Model­le der H‑Serie mit einer TDP von 45 Watt, drei der HS-Serie mit 35 Watt und zwei der U‑Serie mit einer TDP von 28 Watt (kon­fi­gu­rier­bar mit 15 bis 30 Watt). Zusätz­lich betreibt man noch Pro­dukt­pfle­ge und bringt noch drei Ryzen PRO 5000 der U‑Serie, die aller­dings noch einen Vega-Gra­fik­kern besit­zen. (…) Wei­ter­le­sen »

MIT to name Building 12, home of MIT.nano, in honor of Lisa Su

Su is the first MIT alum­na to make a gift for a buil­ding that will bear her own name.

MIT Resour­ce Deve­lo­p­ment — April 7, 2022

Buil­ding 12, the home of MIT.nano, will soon be named in honor of Lisa T. Su ’90, SM ’91, PhD ’94, chief exe­cu­ti­ve offi­cer and chair of the Board of Direc­tors of AMD. Su is the first MIT alum­na to make a gift for a buil­ding that will bear her own name. 

Lisa Su led AMD to its stron­gest per­for­mance in the company’s more than 50-year histo­ry in 2021, brin­ging to mar­ket several lea­ding-edge tech­no­lo­gies. She pre­vious­ly ser­ved in mul­ti­ple roles at Freesca­le Semi­con­duc­tor Inc., IBM, and Texas Instruments.

Su ear­ned bachelor’s, master’s, and doc­to­ral degrees from MIT in electri­cal engi­nee­ring. She has recei­ved many honors inclu­ding two named for MIT alum­ni who were pioneers in her indus­try: the Glo­bal Semi­con­duc­tor Association’s Dr. Mor­ris Chang Exem­pla­ry Lea­ders­hip Award and the Robert N. Noy­ce Medal, the hig­hest honor awar­ded by the Insti­tu­te of Electri­cal and Elec­tro­nics Engi­neers. Su was the first woman ever to recei­ve the Noy­ce medal. (…) Wei­ter­le­sen »

LibreOffice 7.3.2 (Community)

Libre­Of­fice ist ein kos­ten­lo­ses, leis­tungs­star­kes Office-Paket, und ein Nach­fol­ger von OpenOffice(.org). Sei­ne kla­re Ober­flä­che und sei­ne mäch­ti­gen Werk­zeu­ge las­sen Sie Ihre Krea­ti­vi­tät ent­fal­ten und Ihre Pro­duk­ti­vi­tät stei­gern. Libre­Of­fice ver­eint meh­re­re Anwen­dun­gen, was es zum über­zeu­gends­ten frei­en und quell­of­fe­nen Office-Paket auf dem Markt macht: Wri­ter, die Text­ver­ar­bei­tung, Calc die Tabel­len­kal­ku­la­ti­on, Impress, das Prä­sen­ta­ti­ons­pro­gramm, Draw das Zei­chen­pro­gramm, Base die Daten­bank­ver­wal­tung und Math der For­me­ledi­tor. (…) Wei­ter­le­sen »

Die neuen Ryzen 5000 sind da

Wie ange­kün­digt hat AMD gestern eini­ge neue Ryzen-5000-Model­le auf den Markt gebracht. Es han­delt sich dabei nach wie vor um Zen-3-Tech­no­lo­gie in 7 nm, im Prin­zip also um bekann­te Tech­nik. Aller­dings muss­te AMD han­deln, da man ins­be­son­de­re im unte­ren Markt­seg­ment kaum noch kon­kur­renz­fä­hi­ge Gegen­spie­ler zu den Intel Alder-Lake-Pro­zes­so­ren hat­te. (…) Wei­ter­le­sen »

AMD Expands Data Center Solutions Capabilities with Acquisition of Pensando

Pensando’s dis­tri­bu­t­ed ser­vices plat­form expands AMD pro­duct port­fo­lio with a high-per­for­mance packet pro­ces­sor and soft­ware stack alrea­dy deploy­ed at sca­le across cloud and enter­pri­se cus­to­mers inclu­ding Gold­man Sachs, IBM Cloud, Micro­soft Azu­re and Ora­cle Cloud (…) Wei­ter­le­sen »

Intel’s Discrete Mobile Graphics Family Arrives

For deca­des, Intel has been a cham­pion for PC plat­form inno­va­ti­on. We have deli­ve­r­ed genera­ti­ons of CPUs that pro­vi­de the com­pu­ting hor­se­power for bil­li­ons of peop­le. We advan­ced con­nec­ti­vi­ty through fea­tures like USB, Thun­der­bolt™ and Wi-Fi. And in part­ners­hip with the PC eco­sys­tem, we deve­lo­ped the ground-brea­king PCI archi­tec­tu­re and the Intel® Evo™ plat­form, pushing the bounda­ry for what mobi­le pro­ducts can do. 

Intel is uni­que­ly posi­tio­ned to deli­ver PC plat­form inno­va­tions that meet the ever-incre­a­sing com­pu­ting deman­ds of pro­fes­sio­nals, con­su­mers, gamers and creators around the world. Now, we take the next big step. 

 

Today, we are offi­cial­ly laun­ching our Intel® Arc™ gra­phics fami­ly for lap­tops, com­ple­ting the Intel plat­form. The­se are the first dis­cre­te GPUs from our Intel Arc A‑Series gra­phics port­fo­lio for lap­tops, with our desk­top and work­sta­tion pro­ducts com­ing later this year. You can visit our News­room for our launch video, pro­duct details and tech­ni­cal demos, but I will sum­ma­ri­ze the high­lights of how our Intel Arc plat­form and A‑Series mobi­le GPU fami­ly will deli­ver hard­ware, soft­ware, ser­vices and – ulti­mate­ly – high-per­for­mance gra­phics expe­ri­en­ces. (…) Wei­ter­le­sen »

Geekbench bestätigt 1 MB L2-Cache für Zen 4 – Marktstart schon im Sommer?

Vor kur­zem hat AMD mit Milan‑X und dem Desk­top-Pen­dant Ryzen 7 5800X3D die jüngs­ten Aus­bau­stu­fen der Zen-3-Archi­tek­tur vor­ge­stellt, die bei­de mit dem sta­cked 3D-V-Cache die letz­ten Reser­ven aus dem Design her­aus­kit­zeln sol­len. Am Hori­zont wirft jedoch bereits die kom­men­de Zen-4-Archi­tek­tur ers­te Schat­ten vor­aus. Es gab schon etli­che offi­zi­el­le und inof­fi­zi­el­le Infor­ma­tio­nen dazu. (…) Wei­ter­le­sen »

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous­ton, Texas, United Sta­tes (March 24, 2022) – Octa­vo Sys­tems, the lea­der in mass mar­ket Sys­tem-in-Packa­ge (SiP) solu­ti­ons, today announ­ced a new fami­ly of SiP devices based on the AMD Xilinx® Zynq® UltraS­ca­le+™ MPSoC Archi­tec­tu­re. The OSDZU3, based on the ZU3, pro­vi­des the bene­fits of Sys­tem-in-Packa­ge while deli­vering the per­for­mance and fle­xi­bi­li­ty expec­ted from the Zynq UltraS­ca­le+ architecture.

The OSDZU3 lever­a­ges Inte­gra­ted Cir­cuit manu­fac­tu­ring tech­no­lo­gy to integrate:

  • AMD-Xilinx Zynq UltraS­ca­le+ MPSoC ZU3
  • A Com­ple­te and Fle­xi­ble Power System
  • LPDDR4
  • EEPROM
  • QSPI
  • MEMS Oscil­la­tors
  • Over one hund­red passives
  • All into a sin­gle 20.5mm x 40mm BGA

(…) Wei­ter­le­sen »

MSI AMD 500‑, 400- and 300-series Motherboards Are Ready to Optimize the Latest Ryzen™ 5000 & 4000 Series Processors

[Tai­pei, Tai­wan] AMD recent­ly announ­ced the latest “Zen 3” and “Zen 2” new pro­ces­sors are com­ing to the mar­ket very soon for DIY users, which inclu­des the ground-bre­a­­king AMD 3D V‑Cache tech­no­lo­gy pro­ces­sor, the AMD Ryzen™ 7 5800X3D. Moreo­ver, the main­stream Ryzen™ 7 5700X, Ryzen™ 5 5600, Ryzen™ 5 5500, Ryzen™ 5 4600G, Ryzen™ 5 (…) Wei­ter­le­sen »